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首页> 外文期刊>Magnetics, IEEE Transactions on >Microstructures and Magnetic Properties of ${rm CoPt{-}SiN}_{x} {-}{rm Ag}$ Granular Thin Films With Ag Underlayer
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Microstructures and Magnetic Properties of ${rm CoPt{-}SiN}_{x} {-}{rm Ag}$ Granular Thin Films With Ag Underlayer

机译:<分子式 $ {rm CoPt {-} SiN} _ {x} {-} {rm Ag} $ 的微观结构和磁性Ag底层的颗粒状薄膜

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When the Ag layer was introduced under the CoPt alloy film which annealed at 700 $^{circ}{rm C}$ , the CoPt/Ag films had large out-of-plane squareness $({S}_{perp})$, out-of-plane coercivity $({H}_{{c}perp})$, and saturation magnetization $({M}_{s})$ . They were 0.95, 1432 kA/m, and 390 ${rm emu/cm}^{3}$, respectively. Further, the ${rm SiN}_{x}$ ceramic materials were cosputtered with CoPt on the Ag underlayer at room temperature and then annealed to reduce the grain size of CoPt films. From the field-emission gun high-resolution transmission electron microscope analysis, the particle size of CoPt was about 10 nm as the ${rm SiN}_{x}$ content was 46.2 vol.%. Furthermore, Ag was added into the ${rm CoPt{-}SiN}_{x}$ films to reduce the transformation temperature of CoPt films from face-centered-cubic to face-centered-tetragonal structure.
机译:当将Ag层引入CoPt合金膜下并在700退火的CoPt合金膜下方时,公式如下:公式=“ inline“> $ ^ {circ} {rm C} $ , CoPt / Ag薄膜具有较大的面外垂直度。 $({S} _ {perp})$ 面矫顽力<公式公式类型=“ inline”> $({H} _ {{c} perp})$ ,饱和磁化强度<公式公式类型=“ inline”> $({M} _ {s})$ 。它们分别为0.95、1432 kA / m和390 <配方公式type =“ inline”> $ {rm emu / cm} ^ {3} $ 。此外,在室温下,将 $ {rm SiN} _ {x} $ 陶瓷材料与CoPt共溅射在Ag底层上然后退火以减小CoPt膜的晶粒尺寸。根据场发射枪高分辨率透射电子显微镜分析,CoPt的粒径约为10 nm,这是 $ {rm SiN} _ {x} $ 含量为46.2体积%。此外,将Ag添加到 $ {rm CoPt {-} SiN} _ {x} $ 薄膜中以减少转化CoPt薄膜的温度从面心立方到面心四方结构。

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