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首页> 外文期刊>Device and Materials Reliability, IEEE Transactions on >Investigation of the High-Temperature Operation of AlGaN/GaN HFETs via Studying the Impact of Temperature Dependency of Drift Transport Characteristics
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Investigation of the High-Temperature Operation of AlGaN/GaN HFETs via Studying the Impact of Temperature Dependency of Drift Transport Characteristics

机译:通过研究漂移输运特性的温度相关性影响研究AlGaN / GaN HFET的高温操作

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摘要

Investigation of the reliable operation of AlGaN/GaN HFETs at elevated temperatures is attempted. In this paper, a Monte Carlo-based temperature-dependent mobility model, with incorporation of steady-state velocity overshoot, is employed in modeling the drain current-voltage characteristics of AlGaN/GaN HFETs at 300, 400, and 500 K. One of the major merits of this model is that it employs a very small set of fitting parameters. The modeled drain current-voltage characteristics have been successfully matched to the experimental characteristics at the aforementioned temperatures. While confirming that a brief measurement at these temperatures is of no reliability concern on the quality of the metal-semiconductor contacts, this matching proves that the temperature dependency of the electron drift velocity is the cause of the degradation of drain current within the aforementioned range of temperature. In producing the aforementioned match for the long-gate AlGaN/GaN HFETs, it is also shown that the accurate modeling of the temperature dependency of the low-field drift transport is more consequential than the accurate representation of the transport in the medium-to-high electric fields.
机译:试图研究AlGaN / GaN HFET在高温下的可靠运行。在本文中,基于蒙特卡洛的温度依赖性迁移率模型(结合了稳态速度过冲)被用于对300、400和500 K下的AlGaN / GaN HFET的漏极电流-电压特性进行建模。该模型的主要优点是采用了非常小的拟合参数集。建模的漏极电流-电压特性已成功匹配上述温度下的实验特性。虽然确认了在这些温度下的短暂测量对金属-半导体触点的质量没有可靠性的担心,但这种匹配证明,电子漂移速度的温度依赖性是导致漏极电流在上述范围内下降的原因。温度。在为长栅极AlGaN / GaN HFET产生上述匹配时,还表明,与中场到中场的传输的精确表示相比,对低场漂移输运的温度依赖性的精确建模更为重要。高电场。

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