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首页> 外文期刊>IEEE transactions on device and materials reliability >On the Circuit-Level Reliability Degradation Due to AC NBTI Stress
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On the Circuit-Level Reliability Degradation Due to AC NBTI Stress

机译:AC NBTI应力导致的电路级可靠性下降

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摘要

In this paper, an experimental analysis of the impact of dynamic negative bias temperature instability (NBTI) stress on the CMOS inverter dc response and temporal performance is presented. We analyzed the circuit behavior subjected to ac NBTI in the prospect to correlate the induced degradation with that seen at PMOS device level. The results revealed that, while ac NBTI-induced shift of the inverter features shows both voltage and temperature dependence, it does not always exhibit stress time dependence. Indeed, the time exponent n is found to depend on both voltage and temperature. The analysis of such behavior when correlated with the PMOS threshold shift points toward the coexistence of more than one physical mechanism behind the degradation, where one mechanism could dominate the other under certain stress conditions. Depending on these conditions, circuit lifetime could be more or less affected.
机译:本文对动态负偏置温度不稳定性(NBTI)应力对CMOS逆变器直流响应和时间性能的影响进行了实验分析。我们分析了交流NBTI下的电路行为,以将诱发的退化与在PMOS器件级看到的退化相关联。结果表明,虽然交流NBTI引起的逆变器特性偏移既显示电压又依赖于温度,但它并不总是显示应力时间依赖。实际上,发现时间指数n取决于电压和温度。当与PMOS阈值偏移相关时,对此类行为的分析指出了退化背后的一种以上物理机制的共存,其中在某些应力条件下,一种机制可以主导另一种机制。根据这些条件,电路寿命可能会或多或少受到影响。

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