The Y architecture for on-chip interconnect: analysis and methodology

摘要

The Y architecture for on-chip interconnect is based on pervasive use of 0/spl deg/, 120/spl deg/, and 240/spl deg/ oriented semiglobal and global wiring. Its use of three uniform directions exploits on-chip routing resources more efficiently than traditional Manhattan wiring architecture. This paper gives in-depth analysis of deployment issues associated with the Y architecture. Our contributions are as follows. 1) We analyze communication capability (throughput of meshes) for different interconnect architectures using a multicommodity flow approach and a Rentian communication model. Throughput of the Y architecture is largely improved compared to the Manhattan architecture, and is close to the throughput of the X architecture. 2) We improve existing estimates for the wirelength reduction of various interconnect architectures by taking into account the effect of routing-geometry-aware placement. 3) We propose a symmetrical Y clock tree structure with better total wire length compared to both H and X clock tree structures, and better path length compared to the H tree. 4) We discuss power distribution under the Y architecture, and give analytical and SPICE simulation results showing that the power network in Y architecture can achieve (8.5%) less IR drop than an equally resourced power network in Manhattan architecture. 5) We propose the use of via tunnels and banks of via tunnels as a technique for improving routability for Manhattan and Y architectures.