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Transient simulation of lossy interconnects based on the recursive convolution formulation

机译:基于递归卷积公式的有损互连的瞬态仿真

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摘要

An approach for transient simulation of lossy interconnects terminated in arbitrary nonlinear elements based on convolution simulation is presented. The Pade approximations of each line's characteristics or each multiconductor line's modal functions are used to derive a recursive convolution formulation, which greatly reduces the amount of computation used to perform convolutions. The approach can handle frequency-varying effects, such as skin effects, and general coupling situations. The errors introduced by Pade approximations are analyzed, and a scheme for determining the necessary order for an approximation is developed. The approach has been incorporated in the stepwise equivalent conductance timing simulator (SWEC) for digital CMOS circuits. Comparisons with SPICE3.e indicate that SWEC, which gives accurate results, can be one to two orders of magnitude faster.
机译:提出了一种基于卷积仿真的任意非线性元件中有损互连的瞬态仿真方法。每条线的特征或每条多导体线的模态函数的Pade近似值都可用于得出递归卷积公式,从而大大减少了用于执行卷积的计算量。该方法可以处理频率变化的效应,例如趋肤效应和一般的耦合情况。分析了由Pade逼近引入的误差,并开发了一种确定逼近必要阶数的方案。该方法已合并到用于数字CMOS电路的逐步等效电导时序模拟器(SWEC)中。与SPICE3.e的比较表明,给出准确结果的SWEC可以快一到两个数量级。

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