首页> 外文期刊>IEEE journal of selected topics in quantum electronics >High-brightness semiconductor laser sources for materials processing: stacking, beam shaping, and bars
【24h】

High-brightness semiconductor laser sources for materials processing: stacking, beam shaping, and bars

机译:用于材料加工的高亮度半导体激光源:堆叠,光束整形和棒材

获取原文
获取原文并翻译 | 示例
           

摘要

A compact, reliable semiconductor laser source for materials processing, medical, and pumping applications is described. This industrial laser source relies on a combination of technologies that have matured in recent years. In particular, effective means of stacking and imaging monolithic semiconductor laser arrays (a.k.a., bars), together with advances in the design and manufacture of the bars, have enabled the production of robust sources at market-competitive costs. Semiconductor lasers are presently the only lasers known that combine an efficiency of about 50% with compact size and high reliability. Currently the maximum demonstrated output power of a 10-mm-wide semiconductor laser bar exceeds the 260 W level when assembled on an actively cooled heat sink. (The rated power is in the range of 50-100 W). Power levels in the kilowatt range can be reached by stacking such devices. The requirements on the stacking technique and the optic assembly to achieve high brightness are discussed. Optics for beam collimation in fast and slow axis are compared. An example for an optical setup to use in materials processing will be shown. Spot sizes as low as 0.4 mm/spl times/1.2 mm at a numerical aperture of 0.3 and output power of 1 kW are demonstrated. This results in a power density of more than 200 kW/cm/sup 2/. A setup for further increase in brightness by wavelength and polarization coupling will be outlined. For incoherent coupling of multiple beams into a single core optical fiber, a sophisticated beam shaping device is needed to homogenize the beam quality of stacked semiconductor lasers. Applications economics dictate that reliable operation is achievable at numerous wavelengths (both for wavelength-specific applications and for brightness scaling through geometric wavelength multiplexing) and at ever higher per bar power levels. New material systems and epitaxial structures continue to be evaluated in this pursuit. Here we include details of designs and performance for devices operating at 808, 830, and 915 nm. These include characteristics of both single-emitter devices and bars.
机译:描述了用于材料加工,医疗和泵送应用的紧凑,可靠的半导体激光源。这种工业激光源依赖于近年来成熟的技术组合。特别地,堆叠和成像单片半导体激光器阵列(也称为条)的有效手段,连同条的设计和制造方面的进步,使得能够以具有市场竞争力的成本生产坚固的光源。半导体激光器是目前已知的唯一一种将约50%的效率与紧凑的尺寸和高可靠性结合在一起的激光器。当前,装配在主动冷却的散热器上时,展示的10毫米宽半导体激光棒的最大输出功率超过260瓦。 (额定功率在50-100 W范围内)。通过堆叠此类设备,可以达到千瓦级的功率水平。讨论了对堆叠技术和光学组件实现高亮度的要求。比较了快轴和慢轴上用于光束准直的光学元件。将显示用于材料加工的光学装置的示例。在0.3的数值孔径和1 kW的输出功率下,光斑尺寸低至0.4 mm / spl次/1.2 mm。这导致功率密度大于200 kW / cm / sup 2 /。将概述通过波长和偏振耦合进一步提高亮度的设置。为了将多个光束非相干耦合到单芯光纤中,需要一种精密的光束整形装置来使堆叠的半导体激光器的光束质量均匀化。应用经济学表明,在多种波长(对于特定波长的应用和通过几何波长多路复用进行亮度缩放)下,以及在更高的每巴功率水平下,都可以实现可靠的操作。在这种追求中,新材料系统和外延结构将继续得到评估。在此,我们将介绍在808、830和915 nm下工作的设备的设计和性能的详细信息。这些包括单发射器设备和条的特性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号