Nanobonding Technology Toward Electronic, Fluidic, and Photonic Systems Integration

摘要

In this paper, a review of surface-activation-based nanobonding technology for packaging and integration is presented. In this paper, the focus will be on nanobonding technology for electronic, photonic, and fluidic devices for miniaturized biomedical- and environmental-sensing systems. We describe four different nanobonding techniques that have been developed and successfully implemented in a wide range of materials that include metals, semiconductors, flexible laminations, and ionic materials. Nanobonding technologies are particularly attractive because they offer void-free, strong, and nanoscale bonding at room temperature or at low temperature (<200 °C), and without the need for chemicals, adhesives, and high external pressure. Therefore, there are significant potential and opportunities for nanobonding technologies in the development of low cost, low loss, and high-speed miniaturized emerging systems based on a combination of electronic, fluidic, and photonic devices.