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Accelerating system integration by enhancing hardware, firmware, and co-simulation

机译:通过增强硬件,固件和协同仿真来加速系统集成

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System integration of an IBM eServer™ z990 begins when a z990 book, which houses the main processors, memory, and I/O adapters, is installed in a z990 frame, Licensed Internal Code is “booted” in the service element (SE), and power is turned on. This initial system “bringup,” also referred to as post-silicon integration, is composed of three major steps: initializing the chips, loading embedded code (firmware) into the system, and starting an initial program load (IPL) of an operating system. These processes are serialized, and verification of the majority of the system components cannot begin until they are complete. Therefore, it is important to shorten this critical time period by improving the quality of the integrated components through more comprehensive verification prior to manufacturing. This enhanced coverage is focused on verifying the interaction between the hardware components and firmware (often referred to as hardware and software co-simulation). Verification of the activities of these components first occurs independently and culminates in a pre-silicon system integration process, or virtual power-on (VPO). This paper focuses primarily on the hardware subsystem verification of the CLK chip [which is the interface between the central electronic complex (CEC) and the service element (SE)] and on enhanced co-simulation. It also considers the various environments (collections of hardware simulation models, firmware, execution time control code, and test cases to stimulate model behavior), with their advantages and disadvantages. Finally, it discusses the results of the improved comprehensive simulation effort with respect to system integration for the z990.
机译:IBM eServer™z990的系统集成始于将装有主处理器,内存和I / O适配器的z990书籍安装在z990框架中,并且在服务元素(SE)中“引导”了许可内部代码,并打开电源。此初始系统“ bringup”(也称为后硅集成)包括三个主要步骤:初始化芯片,将嵌入式代码(固件)加载到系统中以及启动操作系统的初始程序加载(IPL) 。这些过程已序列化,并且大多数系统组件的验证只有在完成后才能开始。因此,重要的是通过在制造之前进行更全面的验证来提高集成组件的质量,从而缩短这一关键时期。这种增强的覆盖范围集中于验证硬件组件和固件(通常称为硬件和软件协同仿真)之间的交互。这些组件的活动的验证首先独立发生,并最终在硅前系统集成过程或虚拟加电(VPO)中达到顶峰。本文主要关注CLK芯片的硬件子系统验证[这是中央电子设备(CEC)与服务元件(SE)之间的接口],以及增强的协同仿真。它还考虑了各种环境(硬件仿真模型,固件,执行时间控制代码和激发模型行为的测试用例的集合),以及它们的优缺点。最后,它讨论了针对z990的系统集成方面改进的综合仿真工作的结果。

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