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Notch toughness evaluation of diffusion-bonded joint of alumina dispersion-strengthened copper to stainless steel

机译:氧化铝弥散强化铜与不锈钢的扩散结合接头的缺口韧性评估

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摘要

Tensile strength of the diffusion-bonded (DB) joint was as large as that of alumina dispersion-strengthened copper (DS Cu), however, the Charpy absorbed energy of the joint was considerably lower than that of DS Cu. Instrumented Charpy impact test and slow-bend Charpy test of the DB joints were performed to clarify the degradation of Charpy absorbed energy. Elasto-plastic analyses were also carried out in order to study the deformation behavior of the tensile and Charpy V-notched specimens for the DB joints. As a result, the fracture behavior of the impact and slow-bend tests was almost the same. Elasto-plastic analyses showed that the maximum strain occurred at the DS Cu apart from the interface for tensile specimen, however, the strain concentrated at the DS Cu near the interface for the Charpy notched specimen. This strain concentration arose from the mechanical heterogeneity between stainless steel and DS Cu in the bonded zone and can be attributed to the degradation of the absorbed energy of the DB joints.
机译:扩散结合(DB)接头的拉伸强度与氧化铝弥散强化铜(DS Cu)的拉伸强度一样大,但是,接头的夏比吸收能明显低于DS Cu。对DB接头进行了仪器化的夏比冲击试验和慢弯夏比试验,以阐明夏比吸收能量的降低。为了研究DB接头的拉伸和夏比V型缺口试样的变形行为,还进行了弹塑性分析。结果,冲击试验和慢弯试验的断裂行为几乎相同。弹塑性分析表明,最大应变发生在DS Cu上,而不是拉伸试样的界面处,但是应变集中在夏比缺口试样的界面附近的DS Cu处。这种应变集中是由于不锈钢和DS Cu在结合区之间的机械异质性引起的,并且可以归因于DB接头吸收能量的降低。

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