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Navigating the Outsourcing Options

机译:浏览外包选项

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Manufacturing outsourcing isn't a new concept for the semiconductor industry. Over the past decade, companies up and down the supply chain have adopted outsourcing in various degrees to help offset costs and increase productivity. Recognizing the benefits and potential ramifications of outsourcing and picking the right balance for your company is a matter of strategy. A megatrend occurring in the semiconductor manufacturing industry is having a profound influence on all aspects of the supply chain: the shift to fabless operations and a continued migration of chip production to Asia. Indeed, to a great extent, this trend illuminates an entire discussion on the industry's outsourcing movement and its impact on related operations such as assembly and test. In essence, the most crucial decision facing semiconductor companies today is whether to fabricate their own designs-the traditional IDM model-or go fabless by outsourcing these tasks to independent foundries. Increasingly, as IC products grow more and more complex and time-to-market pressures accelerate, the trend toward more fabless operations is intensifying because it helps companies offset investment in the capital equipment needed to keep pace with innovation.
机译:制造外包对于半导体行业来说不是一个新概念。在过去的十年中,供应链上下的公司都在不同程度上采用了外包,以帮助抵消成本并提高生产率。认识到外包的好处和潜在的后果并为您的公司选择合适的平衡是一个战略问题。半导体制造业的大趋势正在对供应链的各个方面产生深远影响:向无晶圆厂生产的转变以及芯片生产向亚洲的持续迁移。确实,这种趋势在很大程度上说明了整个行业外包活动及其对相关业务(如组装和测试)的影响的整个讨论。从本质上讲,当今半导体公司面临的最关键的决策是是制造自己的设计(传统的IDM模型)还是通过将这些任务外包给独立的代工厂而实现无晶圆厂生产。随着IC产品变得越来越复杂和上市时间压力越来越大,越来越多的无晶圆厂生产的趋势正在加剧,因为它可以帮助公司抵销与创新保持同步所需的资本设备投资。

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