首页> 外文期刊>Evaluation Engineering >Vector vs. Vectorless ICT Test Techniques
【24h】

Vector vs. Vectorless ICT Test Techniques

机译:矢量与无矢量ICT测试技术

获取原文
获取原文并翻译 | 示例
           

摘要

Over the last decade, there has been a move away from powered-up digital in-circuit vector testing to unpowered analog-based (vectorless) device-pin opens testing for large and sometimes small digital devices. Two of the driving factors behind this move are the increasingly complex and custom design of digital devices that are being used and the limited digital in-circuit test (ICT) capabilities of most ICT systems. Most ICT systems on the market today simply do not have the timing and voltage accuracies required to reliably and safely test today's generation of low-voltage, high-speed digital components. At the same time, analog vectorless measurement techniques that can be used to detect open pins have become more acceptable and widespread. The introduction of active capacitive probes and advanced software algorithms has made the open-pin defect detection provided by these techniques acceptable to most manufacturers. ICT program developers also lack the digital device models required to perform digital vector testing, and they do not have the time required to write digital vector models for complex devices.
机译:在过去的十年中,已经从加电的数字在线矢量测试过渡到了无电源的基于模拟的(无矢量)设备引脚对大型和小型数字设备的测试。此举背后的两个驱动因素是正在使用的数字设备的日益复杂和定制设计,以及大多数ICT系统有限的数字在线测试(ICT)功能。当今市场上的大多数ICT系统都根本不具备可靠,安全地测试当今的低压,高速数字组件所需的时序和电压精度。同时,可用于检测开路引脚的模拟无矢量测量技术已变得越来越被接受和广泛使用。有源电容式探头和先进软件算法的引入使这些技术提供的开脚缺陷检测功能为大多数制造商所接受。 ICT程序开发人员还缺少执行数字矢量测试所需的数字设备模型,并且他们没有时间为复杂的设备编写数字矢量模型。

著录项

  • 来源
    《Evaluation Engineering》 |2011年第8期|p.34-37|共4页
  • 作者

    Alan Albee; MichaelJ. Smith;

  • 作者单位

    Alan Albee, the in-circuit test product manager working in Teradyne's System Test Group, has worked at GenRad and Teradyne for 28 years in various engineering, applications, product support, and marketing positions;

    Michael J. Smith has more than 30 years experience in the automatic test and inspection equipment industry with Marconi,GenRad, and Teradyne. The author of numerous papers and articles has chaired iNEMI's Test and Inspection Roadmaping Group for many years. Mr. Smith has a BSc(Hons) in control engineering from Leicester University and is a member of the Institution of Engineering and Technology (MIET);

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号