DesignCon highlights IP and interconnect as well as test and measurement

摘要

DesignCon, held Jan. 31 to Feb. 1 in Santa Clara, provided companies an opportunity to highlight their products and technologies for high-speed digital-communications applications. Relevant products from DesignCon exhibitors including ANSYS, Cadence Design Systems, Keysight Technologies, Molex, National Instruments, Rohde & Schwarz, and Tektronix were highlighted in our January Special Report on high-speed digital design, interconnect, and test. In the runup to and during the event, companies have reported additional capabilities related to IP, components, interconnect, and test and measurement.