Flip-chip processing using die bonders

摘要

A machine that can handle flip-chip and traditional wire bond technologies would provide a flexible manufacturing environment for chip makers. Datacon is convinced it has the solution. The transition from wire bond technology towards flip-chip interconnects forces semiconductor manufacturers and subcontractors to search for bond machines which can deal with both types of technologies. As the number of new advanced packages and assembly processes proliferate, the assembly fab of choice will be the one that can deliver total solutions that are both innovative and flexible.