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首页> 外文期刊>Electron Devices, IEEE Transactions on >Effects of LaSiOxThickness and Forming Gas Anneal Temperature on Threshold Voltage Instability of 4H-SiC MOSFETs With LaSiOx
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Effects of LaSiOxThickness and Forming Gas Anneal Temperature on Threshold Voltage Instability of 4H-SiC MOSFETs With LaSiOx

机译:LaSiO 的厚度和形成气体退火温度对带有LaSiO x 的4H-SiC MOSFET阈值电压不稳定性的影响

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摘要

We report the effects of lanthanum-rich layer thickness and forming gas anneal (FGA) conditions on mobility and threshold voltage (${V} _{{ext {T}}}$) instability of high-mobility 4H-SiC MOSFETs using lanthanum silicate (LaSiOx) interface engineering. MOSFETs with LaSiOxafter high-temperature FGA show significantly improved${V} _{ext {T}}$reliability under positive gate bias. It is found that both the thickness of the initial lanthanum-rich layer and the FGA temperature profoundly influence MOSFET mobility and${V} _{ext {T}}$instability under positive bias. There is a tradeoff between mobility and${V} _{ext {T}}$shift under positive bias.
机译:我们报告了富镧层厚度和气体退火(FGA)条件对迁移率和阈值电压的影响( n $ {V} _ {{ t​​ext {T}}} $$ n)高机动性的不稳定性使用硅酸镧的4H-SiC MOSFET(LaSiO n x n)界面工程。在高温FGA之后,具有LaSiO n x n的MOSFET显示出显着改善 n $ {V} _ { t​​ext { T}} $ n正门偏压下的可靠性。发现初始富镧层的厚度和FGA温度都深刻影响MOSFET的迁移率,并且 n $ {V} _ {文本{T}} $ 在正偏差下的不稳定。在移动性和 n $ {V } _ {文本{T}} $ n在正偏差下移位。

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