机译:一种3D组装式硅嵌入式变压器,用于10MHz,超高隔离度,紧凑的芯片间功率传输
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;
Chengdu CoilEasy Technologies, Company Ltd, Chengdu, China;
Tsinghua National Laboratory for Information Science and Technology, Institute of Microelectronics, Tsinghua University, Beijing, China;
Institute of Microelectronics, Tsinghua University, Beijing, China;
Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Kowloon, Hong Kong;
Coils; Three-dimensional displays; System-on-chip; Silicon compounds; Inductance; Bonding;
机译:对“用于10MHz,超高隔离度,紧凑的芯片到芯片功率传输的3D组装式硅嵌入式变压器”的修正[3月17日356-358]
机译:适用于10MHz,1kV隔离,紧凑型电力传输应用的新型双面硅嵌入式变压器
机译:高效,高隔离度和低频片上功率传输的硅嵌入式变压器
机译:集成紧凑型平面倒F天线(PIFA),具有通过壁短路的功能,可用于3D-SiP中的毫米波无线芯片到芯片(C2C)通信
机译:高效感应电力传输系统的松耦合变压器和调谐网络设计
机译:通过3D模块化转移打印异质组装的超材料和元设备
机译:用于片上隔离信号传输的新型硅嵌入式无芯变压器