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首页> 外文期刊>IEEE Transactions on Electromagnetic Compatibility >An Analysis of Conductor Surface Roughness Effects on Signal Propagation for Stripline Interconnects
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An Analysis of Conductor Surface Roughness Effects on Signal Propagation for Stripline Interconnects

机译:带状线互连的导体表面粗糙度对信号传播的影响分析

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Conductors with a roughened surface have significant effects on high-speed signal propagation on backplane traces designed for a 10+ Gb/s network. An accurate approach to evaluate these effects, including the signal attenuation and the phase delay, is proposed in this paper. A differential extrapolation roughness measurement technique is first used to extract the dielectric properties of the substrate used for lamination, and then a periodic model is used to calculate an equivalent roughened conductor surface impedance, which is then used to modify the transmission line per-unit-length parameters $R$ and $L$. The results indicate that the conductor surface roughness increases the conductor loss significantly as well as noticeably increasing the effective dielectric constant. This approach is validated using both a full-wave simulation tool and measurements, and is shown to be able to provide robust results for the attenuation constant within $pm$0.2 Np/m up to 20 GHz.
机译:表面粗糙的导体对为10+ Gb / s网络设计的背板走线上的高速信号传播具有重大影响。本文提出了一种评估这些影响的准确方法,包括信号衰减和相位延迟。首先使用差分外推粗糙度测量技术提取用于层压的基板的介电性能,然后使用周期模型计算等效的粗糙导体表面阻抗,然后将其用于修改传输线每单位长度参数$ R $和$ L $。结果表明,导体表面粗糙度显着增加了导体损耗,并显着提高了有效介电常数。使用全波仿真工具和测量方法对该方法进行了验证,结果表明,对于高达20 GHz的$ pm $ 0.2 Np / m以内的衰减常数,它能够提供可靠的结果。

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