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The 39th DAC Design the 'Big Easy' Way

机译:第39款DAC设计以“大轻松”方式

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The mission of the EDA industry is to help electronics engineers in transforming a concept nto a shippable product. Toward that end, two factors today predominate in motivating the development of EDA tools: electrophys-ical phenomena responsible for critical design issues for processes smaller than 250 nm and the demand for ubiquitous connectivity, emphasizing the need for new communication methods. DAC (Design Automation Conference, www.dac.com) has served for many years as the bellwether for the EDA industry, and the program of the upcoming conference once again mirrors the promises and shortcomings of the industry. This year's DAC will take place on June 10 through 14 in New Orleans. Like its predecessors, the 39th DAC wil; strive to provide a state-of-the-art picture of the work going on in EDA. This year's technical program underscores that the industry is strengthening the tools it introduced in the last 18 months to support designs targeting 180 nm and smaller (see sidebar "DAC addresses both hardware and software designers"). The semiconductor industry is also beginning to face 100-nm and smaller processes (see sidebar "New issues face designers at processes of 100 nm and smaller").
机译:EDA行业的使命是帮助电子工程师将概念转变为可运输的产品。为此,目前在推动EDA工具的开发中有两个主要因素:对小于250 nm的工艺至关重要的设计问题的电物理现象以及对普遍连接性的需求,从而强调了对新通信方法的需求。 DAC(设计自动化会议,www.dac.com)多年来一直是EDA行业的领头羊,即将举行的会议的计划再次反映了该行业的前景和缺点。今年的DAC将于6月10日至14日在新奥尔良举行。像它的前任一样,第39届DAC狂潮爆发。努力提供EDA中正在进行的工作的最新情况。今年的技术计划强调,该行业正在加强其在过去18个月中引入的工具,以支持针对180 nm及更小尺寸的设计(请参见附文“ DAC同时针对硬件和软件设计师”)。半导体行业也开始面临100纳米和更小的工艺(请参见附文“在100纳米和更小的工艺中面临的新问题”)。

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