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Instrumented film-insert injection compression molding for lens encapsulation of liquid crystal displays

机译:用于液晶显示器透镜封装的仪器化薄膜插入式注射压缩成型

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摘要

A film-insert injection compression molding process was introduced to encapsulate cholesteric liquid crystal displays with flexible and rigid lens for full protection of displays to replace the currently used time consuming hand lamination technique. For this purpose, a new interchangeable cavity instrumented hot runner mold was designed and constructed. This complex method was carefully optimized considering challenges arising from an insert multilayer display with +80% liquid crystal content as well as different thermal expansion coefficients between the layers and the lens material as a high potential of delamination and warpage. Concerning the desired physical properties including transparency, low melt viscosity and melting temperature as well as a wide range of hardness grades from soft (flexible) to hard (rigid), three different hardness grades of thermoplastic polyurethanes were found to be the best candidates for this lens application. During proposed lens encapsulation, the pressure changes were evaluated with screw and mold movements using position detection via displacement transducers attached to track the mold closure and screw forward motion. The quality of encapsulation and shrinkage related problems, as well as their elimination, were all discussed. Display substrate material selection criteria for lowered warpage were defined with supporting thermal characterizations. Among the process parameters, tested also by applying the design of experiments with Taguchi method, mold temperature was found to be the most influential parameter on warpage, followed by pin gate opening time, packing pressure, and cooling time.
机译:引入了薄膜插入式注射压缩成型工艺,以用柔性和刚性透镜封装胆甾型液晶显示器,以完全保护显示器,从而取代目前使用的费时的手动层压技术。为此,设计并制造了一种新型的可互换型腔式热流道模具。考虑到由于插入物多层显示器具有+ 80%的液晶含量以及各层和透镜材料之间的热膨胀系数不同而引起的分层和翘曲的可能性很大,因此对这种复杂的方法进行了仔细的优化。关于所需的物理性能,包括透明度,低熔体粘度和熔融温度以及从软(柔韧性)到硬(硬)的各种硬度等级,发现三种不同硬度等级的热塑性聚氨酯是最佳选择镜头应用。在建议的透镜封装过程中,通过安装在位移传感器上的位置检测通过螺丝和模具移动来评估压力变化,以跟踪模具闭合和螺丝的向前运动。讨论了与封装和收缩有关的质量,以及它们的消除方法。通过支持的热特性定义了降低翘曲的显示基板材料选择标准。在工艺参数中,通过应用Taguchi方法进行的实验设计也进行了测试,发现模具温度是翘曲影响最大的参数,其次是销钉浇口打开时间,填充压力和冷却时间。

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