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Comparative Study on the Separate Extraction of Interface and Bulk Trap Densities in Indium Gallium Zinc Oxide Thin-Film Transistors Using Capacitance–Voltage and Current–Voltage Characteristics

机译:电容电压和电流 - 电压特性单独提取铟镓锌氧化膜晶体管的界面和散装密度的比较研究

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The interface and bulk trap densities were separately extracted from self-aligned top-gate (SA-TG) coplanar indium gallium zinc oxide (IGZO) thin-film transistors (TFTs) using the low-frequency capacitance–voltage (C–V) characteristics and space-charge-limited current (SCLC) under the flat-band condition. In the method based on the C–V curve, the energy distribution of the interface trap density was extracted using the low-frequency C–V characteristics, and that of the bulk trap density was obtained by subtracting the density of interface trap states from the total subgap density of states (DOS) at each energy level. In the SCLC-based method, the energy distribution of the bulk trap density was extracted using the SCLC under the flat-band condition at high drain-to-source voltages, and that of the interface trap density was obtained by subtracting the density of bulk trap components from the total subgap DOS at each energy level. In our experiments, the two characterization techniques provided very similar interface and bulk trap densities and showed that approximately 60% of the subgap states originate from the IGZO/SiO2 interface at the conduction band edge in the fabricated IGZO TFTs, although the two characterization techniques are based on different measurement data. The results of this study confirm the validity of the characterization techniques proposed to separately extract the interface and bulk trap densities in IGZO TFTs. Furthermore, these results show that it is important to reduce the density of interface trap states to improve the electrical performance and stability of fabricated SA-TG coplanar IGZO TFTs.
机译:界面和体积陷阱密度分别从自对准顶栅使用低频电容 - 电压(SA-TG)共面的铟镓锌氧化物(IGZO)薄膜晶体管(TFT)(C-V)特性中提取平带的条件下和空间电荷限制电流(SCLC)。在基于C-V曲线上的方法,使用该低频C-V特性萃取界面陷阱密度的能量分布,并且所述体陷阱密度的通过从减去界面陷阱态密度得到在每一能量水平状态(DOS)的总subgap密度。在基于SCLC-方法,使用在高的漏极 - 源极电压的平带条件下的SCLC萃取体陷阱密度的能量分布,并且该界面陷阱密度的通过减去堆积密度得到的从在每个能级的总subgap DOS陷阱组分。在我们的实验中,两个表征技术提供了非常类似的界面和体积陷阱密度和显示,subgap状态的大约60%来自IGZO / SiO2界面起源于在制造的IGZO TFT的导带边缘,尽管这两个表征技术是基于不同的测量数据。这项研究的结果证实提出要单独提取IGZO TFT的界面和体积密度陷阱的表征技术的有效性。此外,这些结果表明,以减少界面陷阱态密度,以改善电气性能和制造SA-TG的共面稳定性的TFT IGZO是很重要的。

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