首页> 外文期刊>Turkish Journal of Electrical Engineering and Computer Sciences >Lightweight signature scheme to protect intellectual properties of Internet of things applications in system on chip field-programmable gate arrays
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Lightweight signature scheme to protect intellectual properties of Internet of things applications in system on chip field-programmable gate arrays

机译:轻量级签名方案,以保护芯片现场可编程门阵列系统中的系统应用程序的智能特性

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Billions of smart objects in the edge devices offer advanced connectivity to networks which increase the security and complexity of the Internet of things (IoT) applications. To make such entities smarter heterogeneous intellectual property (IP) cores from multiple service providers are reused in system on chip platform. Enabling both chip and IP protection at post fabrication level is imperative. The IoT-based IP cores are signed with the hybrid physical unclonable function and finite state machine model to protect from cloning, misuse, unauthorized user access, and physical attacks. The extended finite-state machine is used to verify the signature, which reduces the space and time complexity. The goal is to design a secure plug-and-play system which supports IoT IP core for the unique chip without using any complex algorithms and huge memory storage. Experimental results show that the average overhead values of area and power are 1.05 % and 1.08 % less, respectively, compared with the existing IP protection.
机译:边缘设备中的数十亿个智能对象提供了与网络的高级连接,这增加了事物Internet(IoT)应用程序的安全性和复杂性。为了使这些实体从多次服务提供商中智能的异构知识产权(IP)核心在芯片平台上的系统中重复使用。在邮政制造级别实现芯片和IP保护是必要的。基于物联网的IP核心与混合物理不可渗透功能和有限状态机模型签名,以保护克隆,误用,未经授权的用户访问和物理攻击。扩展的有限状态机用于验证签名,从而降低了空间和时间复杂度。目标是设计一个安全的即插即用系统,支持IP核心的唯一芯片,而无需使用任何复杂的算法和巨大的内存存储。实验结果表明,与现有的IP保护相比,区域和功率平均架空值分别为1.05%和1.08%。

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