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首页> 外文期刊>International Journal of Engineering Research and Applications >Process Parameter Optimization of WEDM for AISI M2 & AISI H13 by Anova & Analytic Hierarchy Process
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Process Parameter Optimization of WEDM for AISI M2 & AISI H13 by Anova & Analytic Hierarchy Process

机译:ANOVA和层次分析法优化AISI M2和AISI H13的WEDM工艺参数

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WEDM is a widely recognized unconventional material cutting process used to manufacture components with complex shapes and profiles of hard materials. In this thermal erosion process, there is no physical contact between the wire tool and work materials. AISI M2 and AISI H13 materials are taken for studyand molybdenum wire electrode diameter (0.18mm); experiment is conducted according to Taguchi?s L16 OA, with input parameters as Peak current, Pulse on, Pulse off their response on MRR, Surface Roughness, Kerf width & Spark Gap is analysed to check the significance of each using ANOVA. Process parameter optimization is done by Analytic Hierarchy Process with the criteria Maximum MRR, minimum kerf and surface roughness. It is observed that for material AISI M2 at low value of peak current (1 A), pulse off (20μs) and pulse on (30μs) we can minimize surface roughness (3.30μm), kerf width (0.195 mm) and maximize MRR (0.022 g/min),from the selected levels whereas for material AISI H13 Peak current (1A), Pulse On (40μs) and high Pulse Off (30μs) we get better Surface roughness (3.71 μm), kerf width (0.196mm) and maximum MRR (0.020g/min), from the selected levels.
机译:WEDM是一种公认​​的非常规材料切割工艺,用于制造具有复杂形状和硬质材料轮廓的组件。在这种热腐蚀过程中,线工具与工作材料之间没有物理接触。采用AISI M2和AISI H13材料进行研究,钼丝电极直径(0.18mm);根据Taguchi的L 16 OA进行实验,分析输入参数为峰值电流,脉冲接通,脉冲断开对MRR的响应,表面粗糙度,切口宽度和火花隙,以检查其重要性。每个使用方差分析。工艺参数优化是通过“层次分析法”(Analytic Hierarchy Process)完成的,标准为“最大MRR”,“最小切口”和“表面粗糙度”。可以看出,对于AISI M2材料,在低峰值电流(1 A),脉冲断开(20μs)和脉冲接通(30μs)的情况下,我们可以最小化表面粗糙度(3.30μm),切口宽度(0.195 mm)和最大MRR( 0.022 g / min),从选定的水平开始,而对于材料AISI H13峰值电流(1A),脉冲开启(40μs)和高脉冲关闭(30μs),我们可以获得更好的表面粗糙度(3.71μm),切口宽度(0.196mm)和最高水平的MRR(0.020g / min),来自选定的水平。

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