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首页> 外文期刊>Journal of Engineering Research >Study of surface morphology and optical characterization of crystalline and multi-crystalline silicon surface textured in highly diluted alkaline solutions
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Study of surface morphology and optical characterization of crystalline and multi-crystalline silicon surface textured in highly diluted alkaline solutions

机译:在高度稀释的碱性溶液中织构的晶体和多晶硅表面的表面形态和光学特性的研究

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In this work, alkaline texturing of (100) crystalline Si and multicrystalline Si wafers in?diluted KOH solution leading to pyramidal structures is studied as a function of the etching?temperature. The surface morphology is investigated using Atomic Force Microscopy and?Scanning Electron Microscopy and the surface reflectance is measured by spectrophotometry?in the wavelength range 200-1200 nm. It is found that etching in diluted 1% KOH solution?leads to incomplete surface texturing when the etching temperature is equal to 70oC. The?optimum etching temperature is found to be in the range 80-85oC which results in a minimum?surface reflectance for crystalline silicon covered with an antireflection coating of 0.8%, with?a uniform distribution over a wider wavelength range for samples that received a saw damage?removal in 30% KOH solution prior to texturing. On the other hand, the optimum etching?temperature shifts to the higher range 85-95oC for multicrystalline silicon surface with a?minimum reflectance of 4.6% with ARC.
机译:在这项工作中,研究了在稀释的KOH溶液中导致金字塔结构的(100)晶体Si和多晶Si晶片的碱性纹理化与蚀刻温度的关系。使用原子力显微镜和“扫描电子显微镜”研究表面形态,并通过分光光度法在200-1200nm的波长范围内测量表面反射率。发现当稀释温度等于70oC时,在稀释的1%KOH溶液中进行蚀刻会导致表面纹理不完整。发现最佳蚀刻温度在80-85oC的范围内,这将使覆盖有0.8%防反射涂层的晶体硅的最小表面反射率达到0.8%,并且对于在较宽的波长范围内均匀分布的样品,看到损伤-在变形前用30%KOH溶液去除。另一方面,对于具有ARC且反射率最低为4.6%的多晶硅表面,最佳蚀刻温度移至85-95oC的较高范围。

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