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首页> 外文期刊>Journal of Advanced Ceramics >Mechanical and dielectric properties of porous and wave-transparent Si3N4-Si3N4 composite ceramics fabricated by 3D printing combined with chemical vapor infiltration
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Mechanical and dielectric properties of porous and wave-transparent Si3N4-Si3N4 composite ceramics fabricated by 3D printing combined with chemical vapor infiltration

机译:制备的多孔且透明的Si 3 N 4 -Si 3 N 4 复合陶瓷的力学和介电性能通过3D打印结合化学气相渗透

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Porous Si3N4-Si3N4 composite ceramics were fabricated by 3D printing combined with low-pressure chemical vapor infiltration (CVI). This technique could effectively improve the designability of porous Si3N4 ceramics and optimize the mechanical and dielectric properties. The effects of process parameters including the deposition time and heat treatment on the microstructure and properties of porous Si3N4-Si3N4 composite ceramics were studied. The study highlights following: When CVI processing time was increased from 0 to 12 h, the porosity decreased from 68.65% to 26.07% and the density increased from 0.99 to 2.02 g/cm3. At the same time, the dielectric constant gradually increased from 1.72 to 3.60; however, the dielectric loss always remained less than 0.01, indicating the excellent electromagnetic (EM) wave-transparent performance of porous Si3N4-Si3N4 composite ceramics. The maximum flexural strength of 47±2 MPa was achieved when the deposition time attained 6 h. After heat treatment, the porosity increased from 26.07% to 36.02% and the dielectric constant got a slight increase from 3.60 to 3.70 with the dielectric loss still maintaining lower than 0.01. It has been demonstrated that the porous Si3N4-Si3N4 composite ceramics are a promising structural and EM wave-transparent material suitable for high temperature service.
机译:通过3D打印结合低压化学气相渗透(CVI)制备了多孔的Si3N4-Si3N4复合陶瓷。这项技术可以有效地提高多孔Si3N4陶瓷的可设计性,并优化其机械性能和介电性能。研究了沉积时间和热处理等工艺参数对多孔Si3N4-Si3N4复合陶瓷组织和性能的影响。研究重点如下:当CVI处理时间从0增加到12 h时,孔隙率从68.65%降低到26.07%,密度从0.99 g / cm3增加到2.02 g / cm3。同时,介电常数从1.72逐渐增加到3.60。然而,介电损耗始终保持在0.01以下,这表明多孔Si3N4-Si3N4复合陶瓷具有优异的电磁波透明性能。当沉积时间达到6 h时,最大弯曲强度达到47±2 MPa。热处理后,孔隙率从26.07%增加到36.02%,介电常数从3.60稍微增加到3.70,介电损耗仍保持在0.01以下。已经证明,多孔的Si 3 N 4 -Si 3 N 4复合陶瓷是一种有希望的结构且EM波透明的材料,适用于高温应用。

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