New Metalized Polyimide Films Structure and Physical Properties

摘要

The classical techniques of PI film metallization by either vapour deposition or electrochemical reduction ofmetals involve necessary technological steps such as polymer surface modification via plasma or ion beam, electronbeam, or photolytic treatment, or surface sensitization by the conferment of catalytic properties, in order to enhance metal-PI adhesion, which is the main problem to be overcome in all processes.