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Influence of Annealing Temperature on the Physical Properties of Cu2SnSe3 Thin Films Prepared by Thermal Vacuum Evaporation Technique

机译:退火温度对热真空蒸发法制备Cu2SnSe3薄膜物理性能的影响

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Ternary compound of semiconductor polycrystals Copper Tin Selenide, Cu2SnSe3, thin films have been prepared by vacuum thermal evaporation technique on well-cleaned glass substrate and annealed in purified nitrogen atmosphere from room temperature to 500°C for different annealing temperature. The annealing effects on surface morphologies, elemental compositions, and electrical behaviour of these films have been investigated using Scanning Electron Microscope (SEM), Energy Dispersive X-Ray (EDX), and Van der Pauw techniques. EDX studies showed that increasing the annealing temperature resulted in drastic loss of Cu content. It is observed that elemental compositions of the Cu2SnSe3 thin films were close to the ideal stoichiometric value 2:1:3. The annealed Cu2SnSe3 thin films were found to be p-type semiconductor with activation energy, ΔEa , of 0.018 eV obtained from I-V characteristic analysis.
机译:通过真空热蒸发技术在清洁良好的玻璃基板上制备半导体多晶三价铜硒化铜,Cu 2 SnSe 3 的三元化合物薄膜,并在纯氮气氛中进行退火从室温到500°C,以适应不同的退火温度。使用扫描电子显微镜(SEM),能量色散X射线(EDX)和Van der Pauw技术已经研究了退火对这些膜的表面形态,元素组成和电性能的影响。 EDX研究表明,提高退火温度会导致铜含量的急剧损失。观察到Cu 2 SnSe 3 薄膜的元素组成接近理想的化学计量比2:1:3。发现经退火的Cu 2 SnSe 3 薄膜为p型半导体,由IV获得的活化能为ΔE a 为0.018 eV。特征分析。

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