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Modeling surface processes and kinetics of compound layerformation during plasma nitriding of pure iron

机译:模拟纯铁等离子渗氮过程中化合物形成的表面过程和动力学

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Different approaches have been developed concerning growth description of the compact nitride layers, especially those produced by ammo- nia. Nitriding by plasma uses a glow discharge technology to introduce nitrogen to the surface which in turn diffuses itself into the material. During this process, the ion bombardment causes sputtering of the specimen surface. This paper presents a mathematical model of compound layer formation during plasma nitriding of pure iron. The model takes into account the erosion effect at the plasma-solid interface due to sputtering. This erosion effect is computer simulated and adjusted in order to consider its contribution to the study of layer growth kinetics. The model is presented as a moving boundary diffusion problem, which considers the observed qualitative behavior of the process.
机译:关于致密氮化物层的生长描述,已开发出不同的方法,特别是氨气产生的方法。通过等离子渗氮使用辉光放电技术将氮引入表面,然后氮自身扩散到材料中。在此过程中,离子轰击会导致样品表面溅射。本文提出了在纯铁的等离子体氮化过程中化合物层形成的数学模型。该模型考虑了由于溅射在等离子体-固体界面处的腐蚀作用。对这种腐蚀作用进行计算机模拟和调整,以考虑其对层生长动力学研究的贡献。该模型以移动边界扩散问题的形式提出,它考虑了所观察到的过程的定性行为。

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