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Effect of High Strain Rate Processing on Strength and Ductility of Ultrafine-grained Cu Processed by Equal Channel Angular Pressing

机译:高应变速率处理对等通道角向压制超细晶粒铜强度和延展性的影响

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Bimodal microstructure consisting of ultrafine-grained (UFG) matrix with the embedded micro-size recrystallized grains has been developed in Cu due to equal channel angular pressing (ECAP) and subsequent high strain rate deformation (HSRD). Both high strength and high ductility are characteristic for this microstructure. High strength is achieved by grain refining with high density of high-angle grain boundaries, developed during the ECAP. High ductility is the result of the appearance of dynamically recrystallized grains generated during the HSRD.
机译:由于等通道角挤压(ECAP)和随后的高应变速率变形(HSRD),在铜中开发了由超细晶粒(UFG)基质和嵌入的微尺寸再结晶晶粒组成的双峰微观结构。高强度和高延展性都是该微结构的特征。通过在ECAP期间开发出具有高密度大角度晶界的晶粒细化来获得高强度。高延展性是由于在HSRD过程中产生的动态再结晶晶粒的出现所致。

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