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MEMS-Based Devices Relevant Failure Modes and Mechanismsfull text in English

机译:基于MEMS的设备的相关故障模式和机制英文全文

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MEMS are one of the most promising areas in future computer and machinery, the next logical step in thesilicon revolution. Substantial process improvements were made with additional inspection to identify weakstructures. MEMS structures exhibit a variety of failure mechanisms, but many can be eliminated through designand existing packaging methods. Packaging is crucial to ensuring long-term reliability. For high reliabilityapplications the packaging costs can often exceed the cost of the device.
机译:MEMS是未来计算机和机械中最有前途的领域之一,是硅革命的下一个逻辑步骤。通过额外检查来确定薄弱结构,从而对工艺进行了重大改进。 MEMS结构表现出多种失效机制,但可以通过设计和现有封装方法消除许多失效机制。包装对于确保长期可靠性至关重要。对于高可靠性应用,包装成本通常会超过设备的成本。

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