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Statistical optimization for process parameters to reduce variability of 32 nm PMOS transistor threshold voltage

机译:对工艺参数进行统计优化,以减少32 nm PMOS晶体管阈值电压的变化

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This paper explains our investigation of the effect on 32 nm PMOS device threshold voltage (VTH) by four process parameters, namely HALO implantation, Source/Drain (S/D) implantation dose, compensation implantations, and silicide annealing time. Taguchi method determines the setting of process parameters in experimental design while analysis of variance (ANOVA) determines the influence of the main process parameters on threshold voltage. The fabrication processes of the transistor were performed by ATHENA fabrication simulator, while the electrical characterization of the device was done by an ATLAS characterization simulator. These two simulators were combined and the results were analyzed by Taguchi’s method in order to aid in design and optimizing process parameters. Threshold voltage (Vth) results were used as the evaluation parameters. The results show that theVTHvalue of –0.10319 Vis achieved for a 32 nmPMOS transistor.In conclusion, by utilizing Taguchi’s method to analyze the effect of process parameters, we can adjust threshold voltage (VTH) for PMOS to a stable value of–0.10319 Vthat is wellwithin ITRS prediction for a 32 nm PMOS transistor.
机译:本文解释了我们对HALO注入,源/漏(S / D)注入剂量,补偿注入和硅化物退火时间这四个工艺参数对32 nm PMOS器件阈值电压(VTH)的影响的研究。 Taguchi方法确定实验设计中的过程参数设置,而方差分析(ANOVA)确定主要过程参数对阈值电压的影响。晶体管的制造过程由ATHENA制造模拟器执行,而器件的电气表征则由ATLAS表征模拟器完成。合并这两个模拟器,并通过Taguchi方法对结果进行分析,以帮助设计和优化工艺参数。阈值电压(Vth)的结果用作评估参数。结果表明,对于32 nmPMOS晶体管,VTH值达到了0.10319 Vis。总而言之,通过使用Taguchi方法分析工艺参数的影响,我们可以将PMOS的阈值电压(VTH)调整为稳定的值。 0.10319 V恰好在32纳米PMOS晶体管的ITRS预测范围内。

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