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首页> 外文期刊>Archives of Metallurgy and Materials >Giant Young’S Modulus Variations in Ultrafine-Grained Copper Caused by Texture Changes at Post-Spd Heat Treatment / Gigantyczne Zmiany Modu?u Younga W Ultra Drobnoziarnistej Miedzi Spowodowane Przez Zmiany Tekstury W Trakcie Obróbki Cieplnej Po SPD
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Giant Young’S Modulus Variations in Ultrafine-Grained Copper Caused by Texture Changes at Post-Spd Heat Treatment / Gigantyczne Zmiany Modu?u Younga W Ultra Drobnoziarnistej Miedzi Spowodowane Przez Zmiany Tekstury W Trakcie Obróbki Cieplnej Po SPD

机译:Spd热处理后由纹理变化引起的超细铜的巨杨模量变化/ SPD热处理后由纹理变化引起的超细铜的巨杨模量变化

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摘要

The effect of annealing on dynamic Young’s modulus, E, of ultrafine-grained (UFG) copper obtained by combined severe plastic deformation (SPD) is investigated. It is established that Young’s modulus in the SPD-prepared samples exceeds that in the coarse-grained fully annealed (CGFA) samples by 10 to 20 %. Isothermal annealing at elevated temperatures between 90 and 630°С leads to a sharp decrease of Young’s modulus for annealing temperatures above 210°С. After annealing at 410°С, the value of E reaches its minimal value that is 35 % lower than E in CGFA samples (total change in E is about 47 % of the initial value). Further annealing at higher temperatures leads to an increase in Young’s modulus. It is shown, that the unusual behavior of Young’s modulus is caused by formation of the 111 axial texture in the SPD-treated samples which then is replaced by the 001 texture during the post-SPD heat treatment.
机译:研究了退火对通过组合严重塑性变形(SPD)获得的超细晶粒(UFG)铜的动态杨氏模量E的影响。已经确定,用SPD制备的样品的杨氏模量比粗晶粒完全退火(CGFA)样品的杨氏模量高10%至20%。在高于210°С的退火温度下,在90-630°С之间的高温下进行等温退火会导致杨氏模量急剧下降。在410°C退火后,E值达到其最小值,比CGFA样品中的E低35%(E的总变化约为初始值的47%)。在更高温度下进一步退火会导致杨氏模量增加。结果表明,杨氏模量的异常行为是由在SPD处理过的样品中形成<111>轴向织构引起的,然后在SPD后热处理过程中被<001>织构代替。

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