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DC Characteristics Optimization of a Double G-Shield 50 V RF LDMOS

机译:双G屏蔽50 V RF LDMOS的直流特性优化

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An N-type 50 V RF LDMOS with a RESURF (reduced surface field) structure of dual field plates (grounded shield, or G-shield) was investigated. The effect of the two field plates and N-drift region, including the junction depth and dopant concentration, on the DC characteristics was analyzed by employing the Taurus TCAD device simulator. A high BV (breakdown voltage) can be achieved while keeping a lowRDSON(on-resistance). The simulation results show that the N-drift region dopant concentration has an obvious effect on the BV andRDSONand the junction depth affected these values less. There is an optimized length for the second field plate for a given dopant concentration of the N-drift region. Both factors should be optimized together to determine the best DC characteristics. Meanwhile, the effect of the first field plate on the BV andRDSONcan be ignored. According to the simulation results, 50 V RF LDMOS with an optimized RESURF structure of a double G-shield was fabricated using 0.35 µm technologies. The measurement data show the same trend as the TCAD simulation, where a BV of 118 V andRDSONof 26 ohm·mm were achieved.
机译:研究了具有双场板(接地屏蔽或G屏蔽)的RESURF(减小表面场)结构的N型50 V RF LDMOS。使用Taurus TCAD设备模拟器分析了两个场板和N漂移区(包括结深和掺杂剂浓度)对DC特性的影响。可以保持较高的BV(击穿电压),同时保持较低的RDSON(导通电阻)。仿真结果表明,N-漂移区掺杂物浓度对BV和RDSON有明显影响,结深对这些值的影响较小。对于给定的N漂移区掺杂浓度,第二场极板具有最佳长度。这两个因素应一起优化以确定最佳的直流特性。同时,可以忽略第一场板对BV和RDSON的影响。根据仿真结果,采用0.35μm技术制造了具有优化的RESURF结构的双G屏蔽层的50μVRF LDMOS。测量数据显示出与TCAD模拟相同的趋势,其中BV为118 V,RDSON为26 ohm·mm。

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