The working temperature of electronic components directly determines their service life and stability. In order to ensure normal operation of electronic components, cooling the coating is one of the best ways to solve the problem. Based on an acrylic amino-resin system, a dissipating coating was prepared with carbon fiber (CF) as the main thermal conductive filler. The influence of the CF content on the thermal conductivity was determined by the single factor method. The surface structure was observed by scanning electron microscopy (SEM). The results show: With the increase of the CF mass fraction, both the heat dispersion and heat conduction coefficient of the coating tend to increase at first and then decrease, and the heat dissipation effect is optimum when the CF mass fraction is 12.3 wt %. At this point, the coating shows an excellent comprehensive performance, such as 1st level adhesion, H grade hardness, and thermal conductivity of 1.61 W/m·K. Furthermore, this paper explored the radiating mechanism of coating in which CF produces a coating which forms a heat “channel” for rapid heat conduction. When the optimal value is exceeded, the cooling effect is reduced because of the accumulation and the anisotropy of CF.
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机译:电子元件的工作温度直接决定其使用寿命和稳定性。为了确保电子组件的正常运行,冷却涂层是解决问题的最佳方法之一。基于丙烯酸氨基树脂体系,制备了以碳纤维(CF)为主要导热填料的散热涂层。 CF含量对导热系数的影响是通过单因素方法确定的。通过扫描电子显微镜(SEM)观察表面结构。结果表明:随着CF质量分数的增加,涂层的热分散性和导热系数均趋于先增大后减小的趋势,当CF质量分数为12.3 wt%时,散热效果最佳。在这一点上,该涂层表现出优异的综合性能,例如一级粘合性,H级硬度和1.61 W / m·K的导热率。此外,本文探索了涂层的辐射机理,其中CF产生了涂层,该涂层形成了快速导热的热“通道”。当超过最佳值时,由于CF的累积和各向异性,冷却效果降低。
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