Non-Destructive Failure Analysis and Measurement for Molded Devices and Complex Assemblies with X-ray CT and 3D Image Processing Techniques

摘要

X-ray CT and 3D image processing techniques offer a new non-destructive solution for inspecting molded devices and complex assemblies with the following benefits: 1. Reliability of the molded devices and complex assemblies can be accessed without performing further destructive tests. 2. Immediate information for possible internal failure in the molded devices and complex assemblies. 3. Measurement of internal features of interest.