Early active-device testing allows feedback to fab

摘要

The fast pace of data-storage capacity improvement means that the design cycle for new heads is shorter than ever before. To be successful, a head manufacturer must develop a system of rapid feedback to its wafer fabrication facility that will quickly evaluate the magnetic performance of the product with the aim of optimizing yield. At present, most head manufacturers rely on spinstand results for feedback to the wafer fab, so wafers are often made into final HGAs before the evaluation takes place.