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Design and analysis of High impedance surface modified 3D antennas

机译:高阻抗表面改性3D天线的设计与分析

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Three dimensional (3D) antenna offers immense advantages such as improved radiation efficiency, wider bandwidth, reduced footprint, and a thermally efficient system when compared to planar antenna design. 3D antenna is designed by placing the radiation element on a top plane, with the electrical feed line on a lower plane. The 3D antenna mentioned in the past was designed to have a radiating element rest on an array of copper posts which are electrically driven from the feed line on a lower plane. This paper discusses on an improvement towards the 3D antenna design by modifying the ground plane to an high impedance surface (HIS). The HIS modified 3D antenna offers wide band and similar gains for a 2.4?GHz signal frequency for comparable antenna dimensions. The HIS modified through dielectric copper posts antenna was designed and analyzed with other 3D antennas.
机译:与平面天线设计相比,三维(3D)天线具有巨大的优势,例如,辐射效率更高,带宽更宽,占地面积更小以及热效率更高。 3D天线的设计是通过将辐射元件放在顶部平面上,而将供电线放在下面平面上。过去提到的3D天线被设计为具有辐射元件,该辐射元件放置在铜柱阵列上,该铜柱由下平面上的馈电线电气驱动。本文讨论了通过将接地平面修改为高阻抗表面(HIS)来实现3D天线设计的改进。经HIS修改的3D天线可在2.4?GHz信号频率下提供宽带和相似的增益,从而具有可比的天线尺寸。通过介电铜柱天线修改的HIS与其他3D天线一起设计和分析。

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