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Perspective of loss mechanisms for silicon and wide band-gap power devices

机译:硅和宽带隙功率器件的损耗机制的观点

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摘要

With the commercial availability of GaN and SiC-based power semiconductor devices having significantly improved material characteristics, there is a need to discuss the perspective of the underlying physical loss mechanisms of these devices versus their silicon counterparts. This article will compare latest generation Superjunction power transistors versus e-mode GaN HEMTs and SiC MOSFETs in terms of semiconductor losses and their potential for further improvement. A short application section will give practical information on best matching circuits for each device concept.
机译:随着具有显着改善的材料特性的GaN和SiC基功率半导体器件的商业可得性,有必要讨论这些器件与其对应的硅器件之间的潜在物理损耗机理的观点。本文将就半导体损耗及其进一步改进的潜力,比较最新一代的超结功率晶体管与e型GaN HEMT和SiC MOSFET。简短的应用部分将提供有关每种器件概念的最佳匹配电路的实用信息。

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