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Optimal design of a rapid thermal processor via physics-based modeling and convex optimization

机译:通过基于物理的建模和凸优化设计快速热处理器的优化设计

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摘要

Rapid thermal processing (RTP) is a key fabrication technology in the advanced cluster tool. Ever-decreasing feature sizes require extremely tight process control, especially the temperature trajectory to be precisely followed and the temperature uniformity across the wafer to be closely maintained, both of which rely on a good chamber design. Although widely adopted and successful in delivering necessary performance specifications, the empirical approach to the RTP design has its own limitations in two areas: (1) reduction in time-to-market and development cost (2) quantification of performance limits (e.g. best achievable temperature uniformity at the processing temperature). With the advent of powerful computing resources at relatively low cost, a model-based approach provides an alternative to the empirical approach and has better chance to achieve optimal design by virtue of its capability to quantify performance limits at minimal time and cost. In this paper, a physics-based model is derived and validated against experimental data in an effort to realize the model-based approach. With an accurate and predictive model available, the performances of various RTP designs are analyzed via convex optimization. The resulting performance limit also serves as a guideline for control implementation once the RTP design parameters are set for the optimal design.
机译:快速热处理(RTP)是高级群集工具中的关键制造技术。不断减小的特征尺寸要求极其严格的过程控制,尤其是要精确地遵循温度轨迹并要严格保持整个晶片的温度均匀性,这两者都取决于良好的腔室设计。尽管已被广泛采用并成功提供了必要的性能规格,但RTP设计的经验方法在两个方面有其自身的局限性:(1)缩短上市时间和开发成本(2)量化性能极限(例如最佳可实现的)加工温度下的温度均匀性)。随着功能强大的计算资源以相对较低的成本问世,基于模型的方法提供了经验方法的替代方法,并且凭借其以最少的时间和成本量化性能极限的能力,便有更好的机会实现最佳设计。在本文中,基于物理的模型被导出并针对实验数据进行了验证,以实现基于模型的方法。利用准确的预测模型,可通过凸优化分析各种RTP设计的性能。一旦为最佳设计设置了RTP设计参数,由此产生的性能极限也将用作控制实施的指南。

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