机译:使用实验材料插值模型对添加剂制造的晶格填充的实验材料插值模型的拓扑优化
Univ Pittsburgh Dept Mech Engn & Mat Sci Pittsburgh PA 15261 USA|Carnegie Mellon Univ Dept Mech Engn Pittsburgh PA 15213 USA|Carnegie Mellon Univ NextMfg Ctr Pittsburgh PA 15213 USA;
Univ Pittsburgh Dept Mech Engn & Mat Sci Pittsburgh PA 15261 USA;
Tsinghua Univ Sch Aerosp Engn Beijing 100084 Peoples R China;
Carnegie Mellon Univ Dept Mech Engn Pittsburgh PA 15213 USA|Carnegie Mellon Univ NextMfg Ctr Pittsburgh PA 15213 USA;
Phononic-like structures; Band gap; Topology optimization; Lattice infills; Additive manufacturing;