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首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >Spatial and Temporal Resolution of Conjugate Conduction-Convection Thermal Resistance
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Spatial and Temporal Resolution of Conjugate Conduction-Convection Thermal Resistance

机译:共轭对流热阻的时空分辨率

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摘要

A transient, 3-D solution to the heat conduction equation with a small square heat source on an adiabatic surface and Newtonian convection on the opposite side was obtained using Green''s functions. The geometry conservatively models conduction spreading resistance encountered by small, concentrated heat sources such as light-emitting diodes and integrated circuits in general, mounted to larger substrates such as the base of a heat sink experiencing Newtonian convection. The solution is presented for a range of nondimensional parameters. Superposition techniques can also be used to extend the applicability of the current solution to the temperature prediction of arbitrary heat flux patterns in certain cases. This technique only holds for applications where the heat transfer coefficient is not a function of temperature, such as thermal management strategies designed to rely on forced convection with air.
机译:使用格林函数,获得了一个在绝热表面上有一个小正方形热源,在另一侧是牛顿对流的热传导方程的瞬态3-D解。几何形状保守地模拟了小型集中的热源(例如发光二极管和集成电路)遇到的传导扩散电阻,这些热源通常安装在较大的基板(例如经历牛顿对流的散热器的基座)上。提出了针对一系列非维参数的解决方案。在某些情况下,叠加技术还可以用于将当前解决方案的适用性扩展到任意热通量模式的温度预测。该技术仅适用于传热系数不是温度函数的应用,例如设计为依赖于空气强制对流的热管理策略。

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