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机译:无焊剂法制备的Si-Cu基片与Ag-In接合处的热循环可靠性研究
Department of Electrical Engineering and Computer ScienceMaterials and Manufacturing Technology, University of California, Irvine, CA, USA;
Annealing; Bonding; Joints; Reliability; Silicon; Substrates; Electronic packaging; high-temperature electronics; indium; silver; silver solid solution; silver–indium alloys; silver-indium alloys; thermal cycling (TC) test;
机译:Cu-Sn蘑菇块加工倒装芯片接头的接触电阻和热循环可靠性
机译:等温时效和基板的温湿处理对Sn-3.0ag-0.5cu / osp精加工Cu Csp焊点接头可靠性的影响
机译:具有Au / Ni / Cu或Cu衬底焊盘金属化的96.5Sn-3Ag-0.5Cu倒装芯片焊点的电迁移可靠性
机译:有机基材上微观Cu / SnAG双凸块倒装芯片组件的热循环可靠性研究:实验结果与数值分析
机译:热循环下晶圆级芯片级封装(WCSP)的实验和仿真板级可靠性评估
机译:使用I型删失数据预测Sn-3.0Ag-0.5Cu焊点的热循环寿命
机译:芯片部件焊接接头可靠性设计方法(焊接接头裂纹传播模式及设计方法)研究