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28-nm UTBB FD-SOI vs. 22-nm Tri-Gate FinFET Review: A Designer Guide—Part I

机译:28-nm UTBB FD-SOI与22-nm Tri-Gate FinFET评估:设计指南-第一部分

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摘要

Nowadays, transistor technology is going toward the fully depleted architecture; the bulk transistors are becoming more complex in manufacturing as the transistor size is becoming smaller to achieve the high performance especially at the node 28 nm. This is the first of two papers that discuss the basic drawbacks of the bulk transistors and explain the two alternative transistors: 28 nm UTBB FD-SOI CMOS and the 22 nm Tri-Gate FinFET. The accompanying paper, Part II, focuses on the comparison between those alternatives and their physical properties, electrical properties, and reliability tests to properly set the preferences when choosing for different mobile media and consumers' applications.
机译:如今,晶体管技术正朝着完全耗尽的架构发展。随着晶体管尺寸变得越来越小以实现高性能,特别是在节点28 nm处,体晶体管的制造变得越来越复杂。这是讨论体晶体管的基本缺点并解释两种替代晶体管的两篇论文中的第一篇:28 nm UTBB FD-SOI CMOS和22 nm Tri-Gate FinFET。随附的第二部分论文着重于这些替代方案及其物理性能,电气性能和可靠性测试之间的比较,以在选择不同的移动媒体和消费者的应用程序时正确设置首选项。

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