Finite element modeling to analyze durability of BGA/CSP connections during thermal shock

摘要

Personal electronic devices at the user interface, like cell phones, utilize BGA/CSP structure for miniaturization of circuits. These structures are subjected to severe thermal loads due to environment of use. Starting with a microstructure of a failed board due to thermal cycles, the stresses/strains in this structure were analyzed from -40 deg. C to 125 deg. C.