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Low Cost Miniaturization Of An Implantable Prototype

机译:低成本微型化的可植入原型

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Purpose - The purpose of this paper is to present the stages for manufacturing a low-cost miniaturized prototype device, which observes the restrictions of implantable medical devices. The device measures the electrocardiography. The power for the implant is received passively as the same magnetic field as data is transferred to the reader device.rnDesign/methodology/approach - In this manufacturing technique, only easily attachable commercial available components are used, etching is used to simply produce a low-cost double-sided flexible printed circuit board which is converted to 3D by folding.rnFindings - The circuit board was folded into the final shape after component attachment and the final result was a compact 3D package within the specifications determined by the electronics designer. The miniaturized prototype device was successfully tested both in vitro and in vivo. Originality/value - The manufacturing technique of the sensing device can be readily adapted to other devices that need to be miniaturized. The coatings used for electrical insulation and chemical protection and the type of adhesives used for folded packages are easily utilized in similar miniaturization prototypes. By using bare chips, the final product would have been even smaller but for prototyping it is cheaper and faster to use easily acquired and attached components. In the case of mass production, the whole new design, where bare chips with flip chip attachments, integrated passives and/or stacked 3D packages with design considerations such as electrical, thermal and mechanical engineering is justified.
机译:目的-本文的目的是介绍制造低成本微型原型设备的阶段,该阶段遵守可植入医疗设备的限制。该设备可测量心电图。植入物的功率与数据传输到读取器设备的磁场相同,是被动接收的。rn设计/方法/方法-在这种制造技术中,仅使用易于连接的市售组件,通过蚀刻来简单地生产出低功率器件。成本低廉的双面柔性印刷电路板,可通过折叠转换成3D。rnFindings-电路板在组件连接后折叠成最终形状,最终结果是在电子设计师确定的规格范围内的紧凑型3D封装。微型原型设备已在体外和体内成功测试。原创性/价值-传感设备的制造技术可以轻松适应需要小型化的其他设备。用于电绝缘和化学保护的涂料以及用于折叠包装的粘合剂类型很容易用于类似的小型化原型中。通过使用裸芯片,最终产品将更小,但对于原型制造而言,使用容易获得和连接的组件更便宜,更快速。在批量生产的情况下,采用带有倒装芯片附件的裸芯片,集成无源元件和/或堆叠的3D封装并考虑电气,热和机械工程等设计考虑的全新设计是合理的。

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