IMAPS-UK 'Beyond Solder' Technical Seminar National Physical Laboratory, Teddington 30 June 2010

摘要

The　UK　MicroelectronicsrnPackaging Society (IMAPS-UK) held a one-day technical seminar and industry-networking event in conjunction with the Innovative Electronics Manufacturing Research Centre (IeMRC), The Welding Institute (TWI) and The National Physical Laboratory (NPL) at the NPL in Teddington on the 30 June 2010. This event, which was attended by a capacity audience, had the objective of providing an opportunity to learn more about the new interconnection processes and materials that were increasingly providing alternatives to conventional solder and which also enabled new applications not possible via soldering. The full title of the seminar was "Beyond Solder - Helping You Make Reliable Connections".