RF-MEMS switches on a printed circuit board platform

摘要

Purpose - The purpose of this paper is to present a new class of printed circuit board (PCB)-based, radio frequency micro-electro-mechanical systemsrn(RF-MEMS) switches and to describe the packaging method and evaluate performance.rnDesign/methodology/approach - Traditional PCB materials and processes were combined with photolithographic high-density interconnect (HDI)rnand MEMS to form 3D high-performance RF switches.rnFindings - A new type of MEMS RF switch has been developed on a PCB platform. Using processes analogous to those used for silicon MEMS, PCB,rnand HDI technologies were utilized to fabricate these 3D structures. The PCB-based microstructures are "mil-scale" rather than the "micro-scale" ofrnsilicon MEMs. A co-fabrication packaging method for the MEMS RF switch was also developed. The PCB-based MEMS switches have demonstratedrnexcellent RF performance and "hot-switching" RF power-handling capability. PCB-based MEMS RF switches have the advantages of low cost andrnamenability to scale-up for a high degree of integration.rnResearch limitations/implications - Further development on photo imageable dielectric materials will enable this technology to improve yield andrnprocessability.rnOriginality/value - The paper describes the development of PCB-based MEMS RF switches. These elements will enable new applications and enhancernthe functionality of PCBs. They are also more amenable to system integration compared with silicon MEMS.