机译:用于印刷电路板铜电沉积的电子级CuO的制备
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China and Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd, Guangzhou, China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China and Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd, Guangzhou, China;
Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd, Guangzhou, China;
Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd, Guangzhou, China;
Through hole; Blind microvia; Copper oxide; Open-circuit potential-time technology; Electrodeposition;
机译:通过同时电浸-电沉积工艺直接从印刷电路板(PCB)粉末精矿中回收铜
机译:用于电沉积的催化阳极:研究酸性铜印刷电路板(PCB)
机译:超临界甲醇法从废印刷电路板中回收铜的新方法:超细铜材料的制备
机译:电子级铜氧化物:通过HDI印刷电路板的金属化应用于铜电镀溶液
机译:化学镀铜的微观结构和机械性能及其对印刷电路板可靠性的影响。
机译:印刷电路板中的铜/环氧树脂接头:制造和界面破坏机制
机译:使用脉冲电流和喷射器搅动在印刷电路板上增强铜电沉积