Study of pressure balance for Press-Pack IGBTs and its influence on temperature distribution

Zihao Zhao; Lin Liang; Lubin Han

首页> 外文期刊>Chinese Journal of Electrical Engineering >Study of pressure balance for Press-Pack IGBTs and its influence on temperature distribution

【24h】

Study of pressure balance for Press-Pack IGBTs and its influence on temperature distribution

机译：压装式IGBT的压力平衡及其对温度分布的影响的研究

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

Pressure balance is a key technology for Press-Pack IGBT packaging, and is studied in this paper with its influence on the temperature distribution discussed in further when the device is turned on. By establishing the physical model of the Press-Pack IGB

机译：压力平衡是Press-Pack IGBT封装的一项关键技术，本文将对其进行研究，并探讨其对开启器件后温度分布的影响。通过建立Press-Pack IGB的物理模型

著录项

来源
《Chinese Journal of Electrical Engineering》 |2018年第4期|57-63|共7页
作者
Zihao Zhao; Lin Liang; Lubin Han;
展开▼
作者单位

State Key Laboratory of Advanced Electromagnetic Engineering and Technology School of Electrical and Electronic Engineering Huazhong University of Science and Technology Wuhan 430074 China;

School of Optical and Electronic Information Huazhong Univer;

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类
关键词
Insulated gate bipolar transistors; Stress; Temperature distribution; Thermal resistance; Contacts; Analytical models;

机译：绝缘栅双极型晶体管;强调;温度分布热阻;联系人;分析模型;

相似文献

外文文献
中文文献
专利

1. Study of Pressure Balance for Press-Pack IGBTs and Its Influence on Temperature Distribution [J] . Zihao Zhao, Lin Liang, Lubin Han 中国电气工程学报(英文) . 2018,第004期

机译：压力包装IGBT的压力平衡及其对温度分布的影响研究
2. Influence of the clamping pressure on the electrical, thermal and mechanical behaviour of press-pack IGBTs [J] . T. Poller, S. DArco, M. Hernes, Microelectronics & Reliability . 2013,第9a11期

机译：夹紧压力对压装式IGBT的电气，热和机械性能的影响
3. Influence of Uneven Pressure Distribution on Current Distribution in Paralleled Multi-Chips Press Pack IGBT [J] . 真宇邓 Smart Grid . 2020,第3期

机译：不均匀压力分布对并联多芯片电流分布的影响
4. Internal pressure distributions of press-pack IGBT modules under two contact methods [C] . Xizi Zhang, Zhongyuan Chen, Zhongkang Lin, IEEE International Electrical and Energy Conference . 2019

机译：两种接触方式下压装IGBT模块的内部压力分布
5. Characterization of edge-contact influence on tridimensional elastohydrodynamic film shape, pressure, stress and temperature distributions. [D] . Najjari, Morteza. 2014

机译：边缘接触特性对三维弹性流体动力学薄膜形状，压力，应力和温度分布的影响。
6. Influence of heating rate temperature pressure on the structure and phase transition of amorphous Ni material: A molecular dynamics study [O] . Hue Dang Thi Minh, Gelu Coman, Hoc Nguyen Quang, 2020

机译：加热速率温度压力对结构的影响以及无定形Ni材料的相变：分子动力学研究
7. Study of pressure balance for Press-Pack IGBTs and its influence on temperature distribution [O] . Zihao Zhao, Lin Liang, Lubin Han 2018

机译：压力包装IGBT的压力平衡及其对温度分布的影响研究
8. Biologically Active Zone Enhancement (BAZE) Supplemental Study: Mass Balance of RDX Biotransformation and Influence of Aquifer Temperature on RDX biodegradation in Groundwater [R] . Wani, A. H. , Felt, D. R. , Davis, J. L. 2003

机译：生物活性区增强（BaZE）补充研究：RDX生物转化的质量平衡和含水层温度对地下水中RDX生物降解的影响

Study of pressure balance for Press-Pack IGBTs and its influence on temperature distribution

摘要

著录项

相似文献

相关主题

期刊订阅