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A photonic crystal technology compatible with integrated circuit technologies

机译:与集成电路技术兼容的光子晶体技术

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Amorphous silicon oxy-nitride films with refractive indices in a wide range of 1.43-1.75 were obtained by plasma-enhanced chemical vapour deposition of silane, nitrous oxide, and ammonia gases at 300 degrees C. Photonic crystal slabs based on amorphous silicon oxy-nitride material systems were simulated and fabricated. Low-contrast photonic crystal structures for which the refractive index difference between the cladding and the core is small are implemented using this technology. It is shown that even low-contrast photonic crystals can provide fairly wide bandgap. The films were patterned by electron-beam lithography and etched by reactive ion etching. The device fabrication is carried out at low temperature and is independent of the substrate type. Therefore, this technology can be used to integrate photonic crystal-based optical integrated circuits within silicon- and GaAs-based integrated circuits.
机译:通过在300摄氏度下对硅烷,一氧化二氮和氨气进行等离子体化学气相沉积,获得了折射率在1.43-1.75范围内的非晶态氮氧化硅薄膜。基于非晶态氮氧化硅的光子晶体平板材料系统进行了模拟和制造。使用该技术可以实现包层与纤芯之间的折射率差较小的低对比度光子晶体结构。结果表明,即使是低对比度的光子晶体也可以提供相当宽的带隙。通过电子束光刻对膜进行图案化,并通过反应离子蚀刻进行蚀刻。器件制造在低温下进行,与衬底类型无关。因此,该技术可用于将基于光子晶体的光学集成电路集成在基于硅和砷化镓的集成电路内。

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