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Microstructure and Diffusion Behaviors of the Diffusion Bonded Mg/Al Joint

机译:扩散结合的Mg / Al接头的组织和扩散行为

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The diffusion and fracture behaviors of Mg/Al joints are investigated in this paper. The concentration distribution equations at each phase are calculated using Matlab, the predominant processing parameters that control the diffusion behaviors are discussed. The result indicates that the intermetallic compounds (IMCs) at the bonded interface of Mg/Al joint consist of Al_3Mg_2 layer (β) and Al_(12)Mg_(17) layer (γ). Based on the Fick's second law, the error function equations calculated by Matlab is in well accordance with the experiment of diffusion in Mg/Al diffusion bonding process. In addition, elements distribution and thickness of IMCs at the joint interface can be simulated by the error function equations. The microstructures of shear fracture surface show that cleavage steps occur at both fractures.
机译:研究了Mg / Al接头的扩散和断裂行为。使用Matlab计算各相的浓度分布方程,讨论控制扩散行为的主要工艺参数。结果表明,Mg / Al接头结合界面处的金属间化合物(IMCs)由Al_3Mg_2层(β)和Al_(12)Mg_(17)层(γ)组成。根据菲克第二定律,Matlab计算出的误差函数方程与Mg / Al扩散键合过程中的扩散实验完全吻合。此外,可以通过误差函数方程来模拟关节界面处IMC的元素分布和厚度。剪切断口表面的微观结构表明,在两个断口处均发生了劈理步骤。

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