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A kind of PCMs-based lightweight wallboards: Artificial controlled condition experiments and thermal design method investigation

机译:一种基于PCM的轻质墙板:人工控制条件实验和热设计方法研究

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摘要

Building envelopes integrating with phase change materials (PCMs) can achieve excellent thermal storage performance, which would benefit the establishment of comfortable indoor thermal environment and the reduction of building energy consumption. In the present paper, the thermal performance of PCMs-based lightweight wallboards integrating PCMs with insulation materials are investigated by comparative experiments. By using two reduce-scale test cells, the experiments are conducted in an artificial climate chamber which is controlled by harmonic and linearly rising/falling temperature changing processes. The comparisons of different PCM layer arrangements and layout areas on the wallboard thermal performance are conducted. Experimental results depict that the PCMs-based lightweight wallboard with PCM layer arrange on interior surface can reduce 32.4% of the temperature fluctuation amplitude and delay the lag time from 2.9 h to 4.1 h compared with the arrangement on exterior surface. To provide a convenient approach for engineers and architects to estimate the thermal performance of PCM envelopes in early design stage, a simple thermal design method is proposed based on harmonic response method and equivalent specific heat capacity principle. The calculation results of interior surface temperature agree well with the experimental results with an 7.7% relative error. The present work could provide validation data for simulation investigations of PCM envelopes and provide references for PCM envelopes thermal design.
机译:集成有相变材料(PCM)的建筑围护结构可实现出色的储热性能,这将有利于建立舒适的室内热环境并降低建筑能耗。在本文中,通过对比实验研究了基于PCM的轻质墙板的热性能,这些墙板将PCM与绝缘材料集成在一起。通过使用两个缩小规模的测试单元,实验在一个人工气候室中进行,该室由谐波和线性上升/下降温度变化过程控制。进行了不同PCM层布置和布局面积对墙板热性能的比较。实验结果表明,与外表面布置相比,内表面布置有PCM层的基于PCM的轻质墙板可减少32.4%的温度波动幅度,并将滞后时间从2.9 h延迟到4.1 h。为方便工程师和建筑师在设计初期评估PCM封装的热性能,基于谐波响应法和等效比热容原理,提出了一种简单的热设计方法。内表面温度的计算结果与实验结果吻合良好,相对误差为7.7%。本工作可以为PCM外壳的仿真研究提供验证数据,并为PCM外壳的热设计提供参考。

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